PCB Assembly Capality | |
Type of Asssembly | • THD & SMT • Conformal Coating • Wave Soldering and Reflow Soldering |
PCB Type | • High TG • Buried and blind holes • Impedance control • Smallest : 0.2" x 0.2" & Largest: 25.2" x 24"• Single and Multilayer• Flexible |
Components | • Passives parts, smallest size 0201• Fine Pitch, BGA, QFN• IC Programming• Maximum Component Height = 0.787” |
Design file format | • Gerber, .pcb• Bom List (.xls, .csv, . xlsx)• Centroid (Pick-N-Place/XY file) |
Testing | • AOI (Automated Optical Inspection)• X-ray Inspection• Functional testing• ICT (In-circuit testing)• Visual Inspection |
Solder Type | • Lead-free / RoHS compliant |
Procurement | • Full BOM |
BEST was proud that we service customers in different fields during the past10 years, the important is we are improving every day !
Is your electronics manufacturing operation undermining business growth?
Outsourcing decisions can be as a result of a specific, short-term, operational need or as part of a forward-looking strategy. Perhaps you have outgrown your existing premises? Maybe you are struggling to recruit enough staff with the correct skills in order to keep you ahead of the competition? Is further investment in plant and equipment really the right decision for your business?
Whatever your challenges, BEST has the internal management and production capabilities to assist you throughout the entire product lifecycle from introduction through to decline and obsolescence management - all while ensuring consistent and long-term business growth.