Demonstration of process capabilities:
1. Plate thickness:
0.3MM~3.0MM (minimum 0.15mm, maximum thickness can be made according to customer requirements)
2. Ink:
Green oil, blue oil, black oil, white oil, butter red oil, purple, matte black
3. Surface technology: Anti-oxidation (SOP), leaded tin spray, lead-free tin spray, immersion gold, gold plating, silver plating, nickel plating, gold finger, carbon oil
4. Special technology: impedance board, high frequency board, buried blind hole board (minimum hole 0.1mm laser hole)
Model: customized
Number of product layers: multi-layer
Insulating material: organic resin
Flame retardant performance: VO board
Reinforcement material: fiberglass cloth base
Mechanical rigidity: rigid
Material: copper
Insulation layer thickness: thin plate
Processing technology: Calendered foil
Insulating resin: polyimide resin (PI)
Number of production layers: 1~10 layers
Maximum size: 600X600mm
Minimum size: ±0.15mm
Layman’s tolerance: 0.4~3.2mm
Plate thickness specification: ±10%
Board limit line width: 5MIL (0.127mm)
Board limit line distance: 5MIL (0.127mm)
Finished copper thickness: 1OZ (35UM)
Mechanical drilling: 0.25~6.3mm
Aperture tolerance: ±0.075mm
Minimum character: width ≥ 0.15mm/height ≥ 0.85n
Distance from line to outline: ≥12MIL (0.3mm)
Solder mask type: photosensitive ink/matte ink
No spacing panel: Omm
Panel spacing: 1.5mm
One-stop PCBA service, fast delivery.