Layers | 1-2 Layers |
Finished Thickness | 16-134mil (0.4mm-3.4mm ) |
Max. Dimension | 500mm *1200mm |
Copper Thickness | 35um, 70um,1 to 10oZ |
Min Line Width/Space | 4mil (0.1mm ) |
Min Finished Hole Size | 0.95mm |
Min. Drill Size | 1.00mm |
Max. Drill Size | 6.5mm |
Finished Hole Size Tolerance | ±0.050mm |
Aperture Position Precision | ±0.076mm |
Min SMT PAD Size | 0.4mm±0.1mm |
Min.Solder Mask PAD | 0.05mm(2mil) |
Min.Solder Mask Cover | 0.05mm(2mil) |
Solder mask Thickness | >12um |
Surface Finishing | HAL, HAL Lead free,OSP, Immersion Gold, etc |
HAL Thickness | 5-12um |
Immersion Gold Thickness | 1-3mil |
OSP Film Thickness | ENTEK PLUS HT:0.3-0.5um; F2:0.15-0.3um |
Outline Finishing | Routing & Punching; Precision Deviation ±0.10mm |
Thermal Conductivity | 1.0 to 12w/m.k |
FOB Port |
Shenzhen |
Export Carton Dimensions L/W/H |
36 x 26 x 25 Centimeters |
Lead Time |
3–7 days |
Units per Export Carton |
5.0 |
Export Carton Weight |
18 Kilograms |