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Intelligent communication module PCB Printed circuit boards designed for intelligent communication modules used in various applications such as Internet of Things (IoT), wireless communication and data transmission Featured Image
  • Intelligent communication module PCB Printed circuit boards designed for intelligent communication modules used in various applications such as Internet of Things (IoT), wireless communication and data transmission
  • Intelligent communication module PCB Printed circuit boards designed for intelligent communication modules used in various applications such as Internet of Things (IoT), wireless communication and data transmission
  • Intelligent communication module PCB Printed circuit boards designed for intelligent communication modules used in various applications such as Internet of Things (IoT), wireless communication and data transmission

Intelligent communication module PCB Printed circuit boards designed for intelligent communication modules used in various applications such as Internet of Things (IoT), wireless communication and data transmission

Short Description:

1.Application: intelligent mobile terminal

Number of layers: 12 layers of 3 level HDI board

Plate thickness: 0.8mm

Line width line distance: 2/2mil

Surface treatment: gold +OSP


Product Detail

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Product Description

Intelligent communication module1
  • Application: intelligent mobile terminal
  • Number of layers: 12 layers of 3 level HDI board
  • Plate thickness: 0.8mm
  • Line width line distance: 2/2mil
  • Surface treatment: gold +OSP
Intelligent communication module2
  • Application: intelligent mobile terminal
  • Layers: 10 ELIC
  • Plate thickness: 0.8mm
  • Line width line distance: 3/3mil
  • Surface treatment: gold +OSP
Intelligent communication module3
  • Application: intelligent navigation module
  • Number of layers: 8 layers of 2-stage HDI boards
  • Plate thickness: 1.0mm
  • Line width line distance: 3/3mil
  • Surface treatment: gold +OSP
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