SMT assembly including BGA assembly | |
Accepted SMD chips | 01005, BGA, QFP, QFN, TSOP |
Component height | 0.2-25mm |
Min packing | 0201 |
Min distance among BGA | 0.25-2.0mm |
Min BGA size | 0.1-0.63mm |
Min QFP space | 0.35mm |
Min assembly size | (X*Y) 50*30mm |
Max assembly size | (X*Y) 350*550mm |
Pick-placement precision | ±0.01mm |
Placement capability | 0805, 0603, 0402, 0201 |
High pin count press fit available | |
SMT capacity per day | 2,000,000 point |
FOB Port |
Shenzhen |
HTS Code |
8509.90.00 00 |
Lead Time |
15–30 days |