SMT assembly including BGA assembly | |
Accepted SMD chips | 01005, BGA, QFP, QFN, TSOP |
Component height | 0.2-25mm |
Min packing | 0201 |
Min distance among BGA | 0.25-2.0mm |
Min BGA size | 0.1-0.63mm |
Min QFP space | 0.35mm |
Min assembly size | (X) 50 * (Y) 30mm |
Max assembly size | (X) 350 * (Y) 550mm |
Pick-placement precision | ±0.01mm |
Placement capability | 0805, 0603, 0402, 0201 |
High-pin count press fit available | |
SMT capacity per day | 800,000 points |
Our company has professional electronic, IT, appearance, structure engineering teams and three main kinds of manufacture centers: injection molding, SMT, assembly center
Can offer one-stop service to design and manufacture PCBA, electronic products and electric appliances
With many years of experience and manufacturing facilities, we are able to tailor our services and products to meet the needs of our international clients
We maintain high standards of excellence, strive for 100% customer's satisfaction and response within 24 hours
Your positive feedback is much appreciated
We will choose 10 customer's to send free gift every month
After your positive
FOB Port |
China (Mainland) |
Lead Time |
7–15 days |