Application:Aerospace, BMS, Communication, Computer, Consumer Electronics, Home appliance, LED, Medical Instruments, Motherboard, Smart electronics, Wireless charging
Feature:Fexible PCB, High density PCB
Insulation Materials:Epoxy Resin, Metal Composite Materials, Organic Resin
Layers: 1-22 layers
board thickness: 1.6 mm
Copper thickness:1 OZ
Base material: FR4
Minimum hole size:0.2mm
Minimum line width:4 mil
Finished surface: lead free HASL
HT-S1105DS is a mini compact soho 5 port 10/100mbps 4pin head network switch PCBA. It has 5 10/100mbps 4pin head port built-in. Plug n play, no need to configuration. The input voltage 3.3V.
The power, link/act led indicators provide a fast trouble shooting solution.
Model Number: TC280
Category: Surface Mount PCB Terminal Blocks
Circuits: 2Pin
Current Rating: 3.0A
Voltage Rating: 200V
PC Board Mounting Direction:Side entry
Flame Retardant Properties:V1
Insulation Materials:Synthetic Resin
Material:Fiberglass Sheet
Mechanical Rigid:Fexible
Processing Technology:Delay Pressure Foil, Electrolytic Foil
Application:Communication, Computer, Consumer Electronics, Home appliance, Medical Instruments, Motherboard, Smart electronics, Wireless charging
Feature:Fexible PCB, High density PCB
Insulation Materials:Epoxy Resin, Metal Composite Materials
Material:Fiberglass Epoxy Resin & Polyimide Resin
Processing Technology:Delay Pressure Foil, Electrolytic Foil
Application:Aerospace, BMS, Communication, Computer, Consumer Electronics, Home appliance, LED, Medical Instruments, Motherboard, Smart electronics, Wireless charging
Feature:Fexible PCB, High density PCB
Insulation Materials:Epoxy Resin, Metal Composite Materials, Organic Resin
Material:Aluminum Covered Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber
Processing Technology:Delay Pressure Foil, Electrolytic Foil
We are manufacture pcb and pcb assembly one-stop service factories. have 400peoples total. 20% increase sales volume each year. 70% production all from overseas. we make 1-12layer.FR4.CEM-1.CEM-3.HDI. AL material.
Aerospace, Communication, Computer, Consumer Electronics, Home appliance, LED, Medical Instruments, Motherboard, Smart electronics, Wireless charging
Flame Retardant Properties:V0, V1, V2
Insulation Materials:Epoxy Resin, Metal Composite Materials, Organic Resin
Material:Complex, Fiberglass Epoxy, Paper Phenolic Copper Foil Substrate, Synthetic Fiber, The Paper Ring Gas Resin
Mechanical Rigid:Fexible
Feature:Rigid Flex pcb
Layers:Multilayer
Application:
Aerospace, BMS, Communication, Computer, Consumer Electronics, Home appliance, LED, Medical Instruments, Motherboard, Smart electronics, Wireless charging
Insulation Materials:
Epoxy Resin, Metal Composite Materials, Organic Resin
Material:
Aluminum Covered Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber
Processing Technology:
Delay Pressure Foil, Electrolytic Foil