Application:Aerospace, BMS, Communication, Computer, Consumer Electronics, Home appliance, LED, Medical Instruments, Motherboard, Smart electronics, Wireless charging
Feature:Fexible PCB, High density PCB
Insulation Materials:Epoxy Resin, Metal Composite Materials, Organic Resin
Material:Aluminum Covered Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber
Processing Technology:Delay Pressure Foil, Electrolytic Foil