Feature:Support custom
Layers:Double-Layer, Multilayer, Single-Layer
Metal Coating:Silver, Tin
Mode of Production:SMT
Type:BMS PCBA, Communication PCBA, Consumer electronics PCBA, Home appliance PCBA, LED PCBA, Motherboard PCBA, Smart electronics PCBA, Wireless charging PCBA
Application:Electronic device, Oem electronic
Supplier Type:Factory, Manufacturer, Oem/odm
Surface Finishing:Hasl, Hasl lead free
Model Number:SHE75192A-101H(A1)
Place of Origin:Guangdong, China
Brand Name:Sanhua
Copper Thickness:5 oz
Key Specifications/ Special Features:
High density interconnected board placement technology capacity
Key Specifications/ Special Features:
We are PCB mass production manufacturer in Shenzhen province China, with UL and TS 16949 approved, our location is close to Shanghai with convenient transportation.
Our products which is widely used in LED indoor and outdoor lighting, car lighting and back lighting fields and more,
All MC PCBs are custom-made, please send Gerber file and requirements for a quote.
Key Specifications/ Special Features:
XinDaChang is specialized in the following areas:
PCBA clone and PCB assembly PCB layout and fabrication.
Lead- Free HASL / Plating gold / immersion gold / Ni / Au Plating gold finger.
Components procurement.
Integrated solutions provider.
Single-sided, double-sided, multilayer.
Flexible, depends on customer’s requirements.
Green/ Black/ Red/ Yellow/ White/Blue…
Offering products with competitive price.
Short lead time.
Application:
Aerospace, BMS, Communication, Computer, Consumer Electronics, Home appliance, LED, Medical Instruments, Motherboard, Smart electronics, Wireless charging.
Feature: Fexible PCB, High density PCB.
Insulation Materials: Epoxy Resin, Metal Composite Materials, Organic Resin.
Material: Aluminum Covered Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber.
Processing Technology: Delay Pressure Foil, Electrolytic Foil.
Key Specifications/ Special Features:
Our Service
• One-stop turnkey OEM/ODM PCBA services.
• pcb,pcb design,PCBA, PCB assembly: SMT, PTH and BGA,Contract Manufacturing,Turnkey service,Engineering Services.
• Electronic components sourcing and purchasing.
• Program burning.
• Test: AOI, X-Ray, in-circuit test (ICT), functional test (FCT).
• Rapid prototyping, NPI, DFM/DFT, fixture creation, packaging design.
• Wire harness, cable assembly, sheet metal assembly ,Plastics and Molds.
• Final product assembly.
Main specifications/Features:
Our advantage
• Rich experience in electronics manufacturing service for PCB PCBA.
• One-stop service | | PCB manufacturing components purchase and PCB assembly, help you easily achieve your electronic products.
• We cooperate in industries involving telecommunications, Internet of Things, radio frequency, intelligent control, security, medical, industrial, automotive, 3G/4G/5G products.
• Reasonable and stable price: A strong global supply chain of electronic components has been established to help us obtain reasonable and stable prices
Key Specifications/ Special Features:
PCB assemblies key specifications/special features:
Our PCB assembly/OEM/ODM contract manufacturing services over 10 years:
PCB fabrication and layout:1 to 20 layers
Components global procurement capability
Mechanical capability
PCB assembly (SMT + DIP + programming + testing)
Key Specifications/ Special Features:
What XinDaChang Can Offer:
1. Printed Circuit Board assembly
2. Turnkey & Box Build assembly
3. Mixed technology PCB assembly
4. Cable and wire harness assembly
5. Low / Mid / High volum PCB assembly
6. BGA / QFN assembly with X-ray inspection
7. IC programming / Function testing / ICT inspection
8. Rapid response includes quotation and technical discussion and delivery
Application:
Aerospace, BMS, Communication, Computer, Consumer Electronics, Home appliance, LED, Medical Instruments, Motherboard, Smart electronics, Wireless charging.
Feature: Fexible PCB, High density PCB.
Insulation Materials: Epoxy Resin, Metal Composite Materials, Organic Resin.
Material: Aluminum Covered Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber.
Processing Technology: Delay Pressure Foil, Electrolytic Foil