Key Specifications/ Special Features:
PCBA/PCB assembly specifications:
1. PCB layers: 1 to 36 layers (standard)
2. PCB materials/types: FR4, aluminum, CEM 1, super thin PCB, FPC/gold finger, HDI
3. Assembly service types: DIP/SMT or mixed SMT and DIP
4. Copper thickness: 0.5-10oz
5. Assembly surface finish: HASL, ENIG, OSP, immersion tin, immersion Ag, flash gold
6. PCB dimensions: 450x1500mm
7. IC pitch (min): 0.2mm
8. Chip size (min): 0201
9. Leg distance (min): 0.3mm
10. BGA sizes: 8×6/55x55mm
11. SMT efficiency: SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
12. u-BGA ball diameter: 0.2mm
13. Required docs for PCBA Gerber file with BOM list and pick-n-place file (XYRS)
14. SMT speed chip components SMT speed 0.3S/piece, max speed 0.16S/piece